Chip&Sensor Packaging

We specialize in plastic packaging technology, delivering high-reliability solutions for MEMS sensors and ICs. Our capabilities cover specialty forms such as SiP, cavity, and window packaging, as well as standard packages and plastic housings. With proven expertise, we ensure stable performance and enable broader IoT applications.

Package is the key to open sensors’ more practical applications

Sensing is the foundation of IoT, with MEMS and sensors at its core. Packaging is the key to unlocking broader real-world applications of sensors. Starting from packaging, we are delivering the key that opens the door to the IoT market.

MEMS-Optimized Packaging

Standard Plastic Packages

Plastic Housing Solutions

Fast-Turnaround Services

MEMS-Optimized Packaging

• SiP (System in Package): High integration and miniaturization for complex IoT systems.
• Cavity Packaging: Enhanced protection for sensors in harsh environments.
• Window Packaging: Optimized for optical and sensing applications.

Standard Plastic Packages

We support mainstream plastic encapsulation formats, ensuring compatibility and cost-effectiveness.
• QFN,QFP,SOP,SOT,BGA, LGA, and other common standards
• Flexible options for different sensor and IC types

Plastic Housing Solutions

•Series Open Tool QFN Plastic Packages
Standard JEDEC-compliant sizes with electrical performance comparable to customized sealed packages. Ideal for rapid validation and testing of engineering samples, offering stable mechanical reliability.
•Customized Plastic Packages
Designed for MEMS sensors (optical, gas, pressure, etc.) and RF devices, supporting reliability certification, high-frequency performance, and diverse encapsulation needs across materials and structures.

Fast-Turnaround Services

• Prototype and small-batch encapsulation with quick delivery
• Ideal for R&D validation and pilot production

Sensor Packaging Technology Roadmap

This is a surface-exposed packaging technology that enables MEMS sensors to interact directly with the environment. It ensures both chip protection and high reliability while offering broad adaptability for applications such as optical, gas, and pressure sensing.